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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6843 Issued Date : 1994.07.29 Revised Date : 2002.10.24 Page No. : 1/3 HBC848 NPN EPITAXIAL PLANAR TRANSISTOR Description The HBC848 is designed for switching and AF amplifier amplification suitable for automatic insertion in thick and thin-film circuits. Absolute Maximum Ratings SOT-23 * Maximum Temperatures Storage Temperature .......................................................................................... -55 to +150 C Junction Temperature.................................................................................................... +150 C * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ............................................................................... 225 mW * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage ......................................................................................... 30 V VCEO Collector to Emitter Voltage...................................................................................... 30 V VEBO Emitter to Base Voltage.............................................................................................. 5 V IC Collector Current........................................................................................................ 100 mA Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICBO *VCE(sat)1 *VCE(sat)2 *VBE(sat)1 *VBE(sat)2 VBE(on)1 VBE(on)2 *hFE fT Cob Min. 30 30 5 580 110 Typ. 90 200 700 900 300 3.5 Max. 15 250 600 700 770 800 6 Unit V V V nA mV mV mV mV mV mV MHz pF Test Conditions IC=100uA IC=1mA IE=10uA VCB=30V IC=10mA, IB=0.5mA IC=100mA, IB=5mA IC=10mA, IB=0.5mA IC=100mA, IB=5mA VCE=5V, IC=2mA VCE=5V, IC=10mA VCE=5V, IC=2mA VCE=5V, IC=10mA VCB=10V, f=1MHz, IE=0 *Pulse Test: Pulse Width 380us, Duty Cycle2% Classification Of hFE Rank hFE A 110-220 B 200-450 C 420-800 HBC848 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 100000 Spec. No. : HE6843 Issued Date : 1994.07.29 Revised Date : 2002.10.24 Page No. : 2/3 Saturation Voltage & Collector Current 10000 Current Gain-hFE 100 hFE @ VCE=5V Saturation Voltage (mV) 1000 VBE(sat) @ IC=20IB 10 VCE(sat) @ IC=20IB 100 1 0.1 1 10 100 1000 10 0.1 1 10 100 1000 Collector Current-IC (mA) Collector Current-IC (mA) On Voltage & Collector Current 10000 10 Capacitance & Reverse-Biased Voltage On Voltage (mV) Capacitance (pF) Cob 1 1000 VBE(on) @ VCE=5V 100 0.1 1 10 100 1000 Collector Current-IC (mA) 0.1 0.1 1 10 100 Reverse-Biased Voltage (V) Cutoff Frequency & Collector Current 1000 10000 Safe Operating Area PT=1ms VCE=5V Collector Current-IC (mA) Cutoff Frequence (MHz) 1000 PT=100ms PT=1s 100 100 10 10 1 10 100 1 1 10 100 Collector Current-IC (mA) Forward Voltage-VCE (V) HBC848 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. SOT-23 Dimension Spec. No. : HE6843 Issued Date : 1994.07.29 Revised Date : 2002.10.24 Page No. : 3/3 A L Marking: 3 BS 1 V G 2 8C Rank Code Control Code 3-Lead SOT-23 Plastic Surface Mounted Package HSMC Package Code: N C D H K J Style: Pin 1.Base 2.Emitter 3.Collector *: Typical DIM A B C D G H Inches Min. Max. 0.1102 0.1204 0.0472 0.0630 0.0335 0.0512 0.0118 0.0197 0.0669 0.0910 0.0005 0.0040 Millimeters Min. Max. 2.80 3.04 1.20 1.60 0.89 1.30 0.30 0.50 1.70 2.30 0.013 0.10 DIM J K L S V Inches Min. Max. 0.0034 0.0070 0.0128 0.0266 0.0335 0.0453 0.0830 0.1083 0.0098 0.0256 Millimeters Min. Max. 0.085 0.177 0.32 0.67 0.85 1.15 2.10 2.75 0.25 0.65 Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: * Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HBC848 HSMC Product Specification |
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